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ItemTechnical Parameter
Layer2-64
Thickness0.6-10mm
Copper Thickness0.3-12 oz
Min Mechanical Hole0.1mm
Min Laser Hole0.075mm
HDI1+n+1、2+n+2、3+n+3
Max Aspect Ratio18:1
Max Board Size610mm*1100mm
Min Width/Space2.4/2.4mil
Min Outline Tolerance±0.1mm
Impedance Tolerance±5%
Min PP Thickness0.06mm
Bow & Twist≤0.5%
MaterialsFR4、High-TG 、Rogers、Nelco、RCC、PTFE
Surface FinishedHASL、HASL Pb Free
Immersion Gold/Tin/Silver
OSP、Immersion Gold + OSP
Special CapabilityGold Finger Plating 、Peelable、Carbon ink


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LayerPrototypeMass prductionQuick Turn
2L5days9days48h
4L5days10days3days
6L6days12days3days
8L7days12days4days
10L10days14days4days
12L10days14days5days
14L12days16days6days
16L12days16days6days
18L14days18days6days
20L14days18days8days
22L14days20days8days
24L14days20days8days
26L14days20days10days
28L14days20days10days
30L14days20days10days
32L14days20days10days


Capability

Capability